Rigid-Flex PCB Manufacturing

Thickness of Finished Product ( Flex Part, No Stiffener ):

0.05-0.5mm ( Ultimate:0.5-0.8mm )

Thickness of Finished Product ( Rigid Part ):

0.2-6.0mm

Finished Copper Thickness:

0.5-5 OZ

Min Tracing/Spacing:

3mil / 3mil

Surface Finish:

HASL/OSP - RoHS
ENIG / Hard Gold / Immersion Silver

Impedance Control:

310%

Min Laser Hole:

0.1mm

Min Drilling Hole Diameter:

8mil

Other Techniques:

HDI
Gold Fingers
Stiffener ( Only for PI / FR4 Substrate )

Conductors

·Rolled annealed ( RA ) copper

·Electro deposited ( ED ) copper

Adhesives

. Epoxy

·Acrylic

·Pre-preg

·Pressure Sensitive Adhesive ( PSA )

·Adhesiveless base material

Insulators

·FR-4

·Polyimide

·Polyester, Polyethylene Naphthalate ( PEN ), and Polyethylene
·Terephthalate ( PET )

·Solder mask/Flexible solder mask

·Photo image-able cover lay ( PIC )

Finishes

·Solder ( Tin / Lead or RoHS compliant ) Tin

·Immersion Nickel / Gold / Silver

·Hard Nickel / gold

·OSP